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Package Assembly tool enables MMIC designers to test a IC created by a foundry process on a module and a board. It provides an easy to create test environment to run momentum and EMDS simulation for IC and the module.
It automatically generates the combined layer definition and combined substrate definition for the IC and the module and relieves designers from maunally creating them. Using Package Assembly tool: To use Package Assembly tool:
1. First install Package Assembly tool. A new toolbar is added to the layout window.
2. Create a new project and create artworks for IC and Module. Remove any hierarchy in the artworks.
Note: Package Assembly tool work only on flattened artworks.
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