10/07/2010

DEFORM Die Stress Analysis

http://www.cadfamily.com/downinfo/301440.html

The objective of this lab is to run a die stress analysis. When the stress analysis is being
done on only one tool, a one step simulation is sufficient to get accurate stresses. When
the stress analysis is being done on die assemblies where there is interaction between the
tools, more than one step is typically needed for the die stack to come to a state of
equilibrium under the applied load.
In a typical die stress simulation, the workpiece is removed and the forces exerted onto
the dies by the workpiece are interpolated onto the tools. In this lab, a shrink fit will also be modeled.

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